Circuit board
专利汇可以提供Circuit board专利检索，专利查询，专利分析的服务。并且PURPOSE: To provide a Ni-plating layer with excellent solder wettability by specifying the thickness of the Ni-plating layer of a circuit board composed of an insulating board, a Cu layer formed on the surface of the insulating board by a direct bonding copper method and the Ni-plating layer formed on the copper layer.
CONSTITUTION: The surface roughness of a copper layer which is unified with an insulating board by a DBC method is 3W5 times the roughness of a copper plate before the DBC method is applied. In order to improve solder wettability taking the above mentioned fact into account, the thickness of a nickel-plating layer is selected to be 3W20μm. For instance, a tough-pitch Cu plate (surface roughness: R
max =2μm) is bonded to the surface of an Al
2 O
3 plate of 0.635 mm thickness at points and then bonded and unified with the Al
2 O
3 plate by the DBC method. The surface roughness of the formed Cu layer is R
max =6μm. When an Si pellet is soldered on the surface of the copper layer after a required circuit pattern is formed, the solder wettability is more than 95 % of the soldered area.
COPYRIGHT: (C)1988,JPO&Japio，下面是Circuit board专利的具体信息内容。
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