Solder coating method on lead frame
专利汇可以提供Solder coating method on lead frame专利检索，专利查询，专利分析的服务。并且PURPOSE: To form a solder film which is uniform and thin, and has high quality and good wettability, by applying a flux to a necessary part of a string line lead frame, allowing solder fine powder to adhere to said flux, melting it in inert gas, and forming a solder layer.
CONSTITUTION: A flux 3 is applied to a solder facing necessary part 2 of a string line lead frame 1 after bonding and molding. Subsequently, solder fine powder 4 is brought to fluidization in a state of mist, and allowed to adhere onto the flux 3. Next, it is allowed to reflow in an inert gas 5, the solder fine powder 4 is melted, and a solder film 7 is formed on the necessary part 2. Thereafter, unnecessary solder and flux are washed 14 and eliminated. According to this method, coating of a solder film can be formed uniformly and with high accuracy to the necessary part of a lead frame in a state of string line.
COPYRIGHT: (C)1988,JPO&Japio，下面是Solder coating method on lead frame专利的具体信息内容。
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